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Exsilcap
High Reliability Semiconductor Packaging
Utility Development Corporation offers a wide variety of packaging materials to meet the rigorous demands of today’s semiconductor market.
Exsilcap molding compounds provide excellent long term high temperature performance for numerous ICs, sensors, and passive components. Certain compounds exhibit CTEs as low as 5 ppm/oC and can be designed with no brominated flame retardant additives.
Exsilcap liquid encapsulants withstand reflow soldering up to 260 oC and meet JEDEC Level-2A standards.
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Benefits: |
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| High Adhesion |
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| Anti Popcorn |
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| HighTg |
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| Low CTE |
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| Low Warpage |
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