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EXSILCAP LIQUID ENCAPSULANTS
Liquid Encapsulants for Glob Top, Chip on Board, and Undefill Applications
Exsilcap liquid enacapsulants provide the most effective protection for a variety of electronic packaging configurations. Underfill encapsulants provide excellent flow, superior adhesion, reworkability, low stress and low warpage. The Exsilcap fill encapsulants are formulated to provide excellent thermal shock resistance, chemical resistance, and easy processing. Exsilcap products are suitable for a number of applications including chip on board, ball grid arrays, memory cards, and multi chip modules. All Exsilcap products provide high reliability and can be formulated to provide properties tailored to the customers specifications, such as pot life, CTE, Tg, and cure rate. Exsilcap encapsulants are available as both standard and low ionic impurity grades.
Exsilcap is available in both 10 mL and 30 mL quantities.
Data Sheets:
HT603J
UF2204
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